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Comparative Heat Transfer Characteristics of Conventional Vapor Chamber (CVC) and Loop Vapor Chamber (LVC)

Wasan Srimuang



The heat transfer characteristics of a conventional vapor chamber (CVC) and a loop vapor chamber (LVC) are compared. The test module is made by a stainless box with difference covers : the cover of the CVC is a rectangular plate, and the cover of the LVC is a rectangular plate with overturn-U tubes. In the experiments, temperatures of heat source (Tj) are supplied to an evaporator section in the range of 80 – 100 °C by a change of volts to an electrical heater. The fresh air in the experimental room is used for cooling a condenser section. The velocities (Vair) of fresh air are varied from 1.0 – 1.8 m/s. The results of the present study show that the heat transfer rate of both CVC and LVC are increased with Tj and Vair. In conclusion, the thermal resistance of LVC is lower than that of CVC about 309%.


Vapor chamber, Heat sink, Loop condenser, CPU, Heat pipe

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